Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | I2C|SPI |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 32 |
Automotive | No |
Lead Shape | Ball |
Output Type | Logic |
PCB changed | 32 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 11.25 |
Package Height | 2.82 |
Package Length | 15 |
Supplier Package | BGA |
Maximum Data Rate | 20Mbps |
Standard Package Name | BGA |
Maximum Fall Time (ns) | 35 |
Maximum Rise Time (ns) | 35 |
Forward/Reverse Channels | 3/3 |
Supplier Temperature Grade | Industrial |
Number of Channels per Chip | 6 |
Minimum Isolation Voltage (Vrms) | 2500 |
Maximum Working Insulation Voltage | 560Vp |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 3 |
Minimum Common Mode Rejection (kV/us) | 30 |
Maximum Propagation Delay Time (tPHL) (ns) | 100 |
Maximum Propagation Delay Time (tPLH) (ns) | 100 |
Description |