Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | SPI|I2C |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 24 |
Automotive | No |
Lead Shape | Ball |
Output Type | Logic |
PCB changed | 24 |
Part Status | Active |
Coupling Type | Magnetic Coupling |
Package Width | 6.25 |
Package Height | 2.41 |
Package Length | 9 |
Supplier Package | BGA |
Maximum Data Rate | 20Mbps |
Standard Package Name | BGA |
Maximum Fall Time (ns) | 250 |
Maximum Rise Time (ns) | 250 |
Forward/Reverse Channels | 3/3 |
Supplier Temperature Grade | Commercial |
Number of Channels per Chip | 6 |
Minimum Isolation Voltage (Vrms) | 4200 |
Maximum Working Insulation Voltage | 850Vp |
Maximum ESD Protection Voltage (kV) | ±15@HBM |
Maximum Operating Temperature (°C) | 70 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Minimum Common Mode Rejection (kV/us) | 50 |
Maximum Propagation Delay Time (tPHL) (ns) | 350 |
Maximum Propagation Delay Time (tPLH) (ns) | 350 |
Description |