Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | SPI|I2C |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 36 |
Automotive | No |
Lead Shape | Ball |
Output Type | Open Drain |
PCB changed | 36 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 6.25 |
Package Height | 1.56 |
Package Length | 15 |
Supplier Package | BGA |
Maximum Data Rate | 100Mbps |
Standard Package Name | BGA |
Maximum Fall Time (ns) | 20 |
Maximum Rise Time (ns) | 20 |
Number of Channels per Chip | 2 |
Minimum Isolation Voltage (Vrms) | 5000 |
Maximum Working Insulation Voltage | 1000Vp |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 1.71 |
Minimum Common Mode Rejection (kV/us) | 50 |
Maximum Propagation Delay Time (tPHL) (ns) | 150 |
Maximum Propagation Delay Time (tPLH) (ns) | 150 |
Description |