Product Attribute | Attribute Value |
HTS | 8542330001 |
PPAP | No |
Type | SPI|I2C |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 16 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 16 |
Part Status | Active |
Coupling Type | Magnetic Coupling |
Package Width | 7.5 |
Package Height | 2.35 |
Package Length | 10.3 |
Supplier Package | SOIC W |
Maximum Data Rate | 50Mbps |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 2.2(Typ) |
Maximum Rise Time (ns) | 3(Typ) |
Forward/Reverse Channels | 1/1 |
Supplier Temperature Grade | Industrial |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 210 |
Minimum Isolation Voltage (Vrms) | 5000 |
Maximum Output Current Drive (mA) | 15 |
Maximum Working Insulation Voltage | 2000Vp |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Skew (ns) | 10 |
Maximum Pulse Width Distortion (ns) | 10 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 2.5 |
Minimum Common Mode Rejection (kV/us) | 100 |
Maximum Propagation Delay Time (tPHL) (ns) | 25 |
Maximum Propagation Delay Time (tPLH) (ns) | 25 |
Description |