Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | I2C |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 16 |
Automotive | No |
Output Type | Open Drain |
PCB changed | 16 |
Coupling Type | Capacitive Coupling |
Package Width | 3.9 |
Package Height | 1.5(Max) |
Package Length | 9.9 |
Supplier Package | SOIC N |
Maximum Data Rate | 1.7MHZ |
Maximum Fall Time (ns) | 4.3 |
Maximum Rise Time (ns) | 6 |
Forward/Reverse Channels | 2/2 |
Minimum Pulse Width (ns) | 40 |
Number of Channels per Chip | 4 |
Maximum Power Dissipation (mW) | 275 |
Minimum Isolation Voltage (Vrms) | 2500 |
Maximum Output Current Drive (mA) | 15 |
Maximum Working Insulation Voltage | 560Vp |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Skew (ns) | 20 |
Maximum Pulse Width Distortion (ns) | 12 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Maximum Quiescent Supply Current (mA) | 9.3/9 |
Minimum Common Mode Rejection (kV/us) | 25(Typ) |
Maximum Propagation Delay Time (tPHL) (ns) | 20 |
Maximum Propagation Delay Time (tPLH) (ns) | 20 |
Description |