Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | General Purpose |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 16 |
Automotive | No |
Output Type | CMOS |
PCB changed | 16 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 7.5 |
Package Height | 2.05(Min) |
Package Length | 10.3 |
Supplier Package | SOIC W |
Maximum Data Rate | 150Mbps |
Process Technology | CMOS |
Maximum Fall Time (ns) | 4 |
Maximum Rise Time (ns) | 4 |
Forward/Reverse Channels | 3/0 |
Minimum Pulse Width (ns) | 5 |
Supplier Temperature Grade | Industrial |
Number of Channels per Chip | 3 |
Maximum Power Dissipation (mW) | 275 |
Minimum Isolation Voltage (Vrms) | 5000 |
Maximum Output Current Drive (mA) | 10 |
Maximum Working Insulation Voltage | 1200Vp |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Skew (ns) | 4.5 |
Maximum Pulse Width Distortion (ns) | 4.5 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 2.5 |
Typical Operating Supply Voltage (V) | 3.3|5 |
Minimum Common Mode Rejection (kV/us) | 60 |
Maximum Propagation Delay Time (tPHL) (ns) | 13 |
Maximum Propagation Delay Time (tPLH) (ns) | 13 |
Description |