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XC56L307VF160
XC56L307VF160
Digital Signal Processors - DSPs XC56L307VF160
NXP
XC56L307VF160
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Microcontrollers and Processors
Digital Signal Processors - DSPs
Specification
Product AttributeAttribute Value
HTS8542.31.00.01
PPAPNo
SVHCYes
EU RoHSNot Compliant
MountingSurface Mount
RAM Size192KB
ECCN (US)3A991
PackagingTray
Pin Count196
AutomotiveNo
Lead ShapeBall
PCB changed196
Part StatusObsolete
Package Width15
Package Height1.16
Package Length15
ProgrammabilityNo
Supplier PackageMAP-BGA
Program Memory TypeROM
Data Bus Width (bit)24
Standard Package NameBGA
SVHC Exceeds ThresholdYes
Instruction Set ArchitectureEnhanced Dual Harvard
Numeric and Arithmetic FormatFixed-Point
Device Input Clock Speed (MHz)160
Maximum Operating Temperature (°C)100
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.9|3.6
Minimum Operating Supply Voltage (V)1.7|3
Typical Operating Supply Voltage (V)1.8|3.3
Device Million Instructions per Second (MIPS)160
Description
DSP Fixed-Point 24bit 160MHz 160MIPS 196-Pin MAP-BGA Tray
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