Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | 3A001a.5.b.2.b. |
Packaging | Tray |
Pin Count | 160 |
Automotive | No |
Lead Shape | Ball |
Resolution | 14bit |
Output Type | Current |
PCB changed | 160 |
Part Status | Active |
Architecture | Quad-Switch |
Package Width | 12 |
Converter Type | RF |
Package Height | 1(Max) |
Package Length | 12 |
Conversion Rate | 5.6Gsps |
Output Polarity | Unipolar |
Full Scale Error | 2.5%FSR(Typ) |
Supplier Package | CSP-BGA |
Power Supply Type | Dual |
Voltage Reference | Internal |
Process Technology | 0.18um, CMOS |
Standard Package Name | BGA |
Digital Interface Type | Parallel|LVDS |
Digital Supply Support | Yes |
Number of DAC Channels | 1 |
Maximum Settling Time (us) | 0.013(Typ) |
Number of Outputs per Chip | 1 |
Integral Nonlinearity Error | 1.4LSB(Typ) |
Maximum Power Dissipation (mW) | 1400 |
Maximum Dual Supply Voltage (V) | -1.6/1.9 |
Minimum Dual Supply Voltage (V) | -1.4/1.7 |
Typical Dual Supply Voltage (V) | -1.5/1.8 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Description |