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K9F5608U0D-PCB0000
K9F5608U0D-PCB0000
Flash K9F5608U0D-PCB0000
Samsung Electronics
K9F5608U0D-PCB0000
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeSLC NAND
ECCN (US)3A991.b.1.a
PackagingTray
Page Size512byte
Pin Count48
AutomotiveNo
Boot BlockNo
Lead ShapeGull-wing
ECC SupportYes
PCB changed48
Part StatusObsolete
Sector Size16Kbyte x 2048
Timing TypeAsynchronous
ArchitectureSectored
Package Width18.4
Interface TypeParallel
Package Height1
Package Length12
Number of Words32M
ProgrammabilityYes
Supplier PackageTSOP-I
Block OrganizationSymmetrical
Chip Density (bit)256M
Command CompatibleNo
Program Current (mA)25
Support of Page ModeYes
Max. Access Time (ns)15000
Standard Package NameSOP
Maximum Erase Time (S)0.003/Block
Operating Current (mA)20
Address Bus Width (bit)25
Number of Bits/Word (bit)8
Supplier Temperature GradeCommercial
Maximum Page Access Time (ns)50(Min)
Maximum Programming Time (ms)0.5/Chip
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3.3
Description
SLC NAND Flash Parallel 3.3V 256M-bit 32M x 8 15us 48-Pin TSOP-I Tray
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