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Flash KLM4G1FEAC-B031
Samsung Electronics
KLM4G1FEAC-B031
--
Memory
Flash
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeManaged NAND
ECCN (US)EAR99
AutomotiveNo
Lead ShapeBall
Part StatusActive
Timing TypeSynchronous
Package Width10
Interface TypeSerial e-MMC
Package Height0.8
Package Length11
ProgrammabilityYes
Supplier PackageFBGA
Chip Density (bit)32G
Standard Package NameBGA
Description
Managed NAND Flash Serial e-MMC 32G-bit FBGA
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