Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Cell Type | Managed NAND |
ECCN (US) | EAR99 |
Automotive | No |
Lead Shape | Ball |
Part Status | Active |
Timing Type | Synchronous |
Package Width | 10 |
Interface Type | Serial e-MMC |
Package Height | 0.8 |
Package Length | 11 |
Programmability | Yes |
Supplier Package | FBGA |
Chip Density (bit) | 32G |
Standard Package Name | BGA |
Description |