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LE25S161FDTWG
LE25S161FDTWG
Flash LE25S161FDTWG
onsemi
LE25S161FDTWG
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Page Size256byte
Pin Count8
AutomotiveNo
Boot BlockNo
ECC SupportNo
PCB changed8
Part StatusActive
Sector Size4Kbyte x 1|64Kbyte x 1
Timing TypeSynchronous
ArchitectureSectored
Package Width3.9
Interface TypeSerial (SPI, Dual SPI)
Package Height0.8(Max)
Package Length4.9
Number of Words2M
ProgrammabilityYes
Supplier PackageVSOIC N
Block OrganizationSymmetrical
Chip Density (bit)16M
Command CompatibleNo
Program Current (mA)7.5
Support of Page ModeNo
Maximum Erase Time (s)210/Chip
Operating Current (mA)8
Address Bus Width (bit)24
Programming Voltage (V)1.65 to 1.95
Number of Bits/Word (bit)8
Maximum Programming Time (ms)0.7/Page
Maximum Operating Temperature (°C)90
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.65
Typical Operating Supply Voltage (V)1.8
Description
Flash Serial-SPI 1.8V 16M-bit 2M x 8 8-Pin VSOIC N T/R
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