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LE25S161MDTWG
LE25S161MDTWG
Flash LE25S161MDTWG
onsemi
LE25S161MDTWG
--
Memory
Flash
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Page Size256byte
Pin Count8
AutomotiveNo
Boot BlockNo
Lead ShapeGull-wing
ECC SupportNo
PCB changed8
Part StatusLTB
Sector Size4Kbyte x 1|64Kbyte x 1
Timing TypeSynchronous
ArchitectureSectored
Package Width4(Max)
Interface TypeSerial (SPI, Dual SPI)
Package Height1.5(Max)
Package Length5(Max)
Number of Words2M
ProgrammabilityYes
Supplier PackageSOIC N
Block OrganizationSymmetrical
Chip Density (bit)16M
Command CompatibleNo
Program Current (mA)7.5
Support of Page ModeNo
Standard Package NameSOP
Maximum Erase Time (s)210/Chip
Operating Current (mA)8
Address Bus Width (bit)24
Programming Voltage (V)1.65 to 1.95
Number of Bits/Word (bit)8
Maximum Programming Time (ms)0.7/Page
Maximum Operating Temperature (°C)90
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.65
Typical Operating Supply Voltage (V)1.8
Description
Flash Serial-SPI 1.8V 16M-bit 2M x 8 8-Pin SOIC N T/R
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