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LE25U20AQGTXG
LE25U20AQGTXG
Flash LE25U20AQGTXG
onsemi
LE25U20AQGTXG
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Page Size256byte
Pin Count8
AutomotiveNo
Boot BlockNo
Lead ShapeNo Lead
ECC SupportNo
PCB changed8
Part StatusActive
Sector Size64Kbyte x 4
Timing TypeSynchronous
ArchitectureSectored
Package Width3
Interface TypeSerial-SPI
Package Height0.75(Max)
Package Length2
Number of Words256K
ProgrammabilityYes
Supplier PackageWDFN EP
Chip Density (bit)2M
Command CompatibleYes
Process TechnologyCMOS
Support of Page ModeYes
Max. Access Time (ns)15
Standard Package NameDFN
Maximum Erase Time (S)2.5/Sector
Operating Current (mA)6
Address Bus Width (bit)24
Programming Voltage (V)2.3 to 3.6
Number of Bits/Word (bit)8
Minimum Endurance (Cycles)1000000(Typ)
Maximum Programming Time (ms)5/Page
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.3
Typical Operating Supply Voltage (V)2.5
Description
Flash Serial-SPI 2.5V 2M-bit 256K x 8 15ns 8-Pin WDFN EP T/R
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