Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Cell Type | SLC NAND |
ECCN (US) | EAR99 |
Packaging | Tray |
Page Size | 2Kbyte |
Pin Count | 63 |
Automotive | No |
Boot Block | Yes |
Lead Shape | Ball |
ECC Support | Yes |
PCB changed | 63 |
Part Status | Active |
Sector Size | 128Kbyte x 2048 |
Timing Type | Asynchronous |
Architecture | Sectored |
Package Width | 10.5 |
Interface Type | Parallel |
Package Height | 0.65 |
Package Length | 13 |
Number of Words | 256M |
Programmability | Yes |
Supplier Package | VFBGA |
Block Organization | Symmetrical |
Chip Density (bit) | 2G |
Command Compatible | No |
Program Current (mA) | 20 |
Support of Page Mode | Yes |
Standard Package Name | BGA |
Maximum Erase Time (s) | 0.003/Block |
Operating Current (mA) | 20 |
Address Bus Width (bit) | 29 |
Number of Bits/Word (bit) | 8 |
Minimum Endurance (Cycles) | 100000 |
Supplier Temperature Grade | Industrial |
Maximum Programming Time (ms) | 0.6/Page |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.95 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |