Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Cell Type | SLC NAND |
ECCN (US) | 3A991.b.1.a |
Pin Count | 63 |
Automotive | No |
Lead Shape | Ball |
ECC Support | Yes |
PCB changed | 63 |
Part Status | Active |
Timing Type | Asynchronous |
Package Width | 9 |
Interface Type | Parallel |
Package Height | 1(Max) - 0.25(Min) |
Package Length | 11 |
Number of Words | 256M |
Programmability | Yes |
Supplier Package | VFBGA |
Chip Density (bit) | 2G |
Standard Package Name | BGA |
Number of Bits/Word (bit) | 8 |
Supplier Temperature Grade | Automotive |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |