Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Cell Type | Managed NAND |
ECCN (US) | 3A991.b.1.a |
Packaging | Tape and Reel|Tray |
Pin Count | 153 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 153 |
Part Status | Obsolete |
Timing Type | Synchronous |
Package Width | 11.5 |
Interface Type | Serial e-MMC |
Package Height | 0.64(Min) |
Package Length | 13 |
Number of Words | 16G |
Programmability | Yes |
Supplier Package | VFBGA |
Chip Density (bit) | 128G |
Standard Package Name | BGA |
Number of Bits/Word (bit) | 8 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Typical Operating Supply Voltage (V) | 3.3 |
Description |