Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Cell Type | Managed NAND |
ECCN (US) | 3A991.b.1.a |
Pin Count | 169 |
Automotive | No |
Boot Block | Yes |
Lead Shape | Ball |
ECC Support | Yes |
PCB changed | 169 |
Part Status | Obsolete |
Timing Type | Synchronous |
Architecture | Sectored |
Package Width | 14 |
Interface Type | Serial e-MMC |
Package Height | 1.04(Min) |
Package Length | 18 |
Number of Words | 512G/128G/64G |
Programmability | Yes |
Supplier Package | LFBGA |
Chip Density (bit) | 512G |
Command Compatible | No |
Support of Page Mode | No |
Standard Package Name | BGA |
Number of Bits/Word (bit) | 1/4/8 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3.3 |
Description |