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NAND08GAH0BZA5E
NAND08GAH0BZA5E
Flash NAND08GAH0BZA5E
Micron Technology
NAND08GAH0BZA5E
--
Memory
Flash
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeManaged NAND
ECCN (US)3A991.b.1.a
Pin Count169
AutomotiveNo
Boot BlockYes
Lead ShapeBall
ECC SupportYes
PCB changed169
Part StatusUnconfirmed
Sector Size512byte x 2097152
Timing TypeSynchronous
ArchitectureSectored
Package Width12
Interface TypeSerial e-MMC
Package Height1
Package Length16
Number of Words8G/2G/1G
ProgrammabilityYes
Supplier PackageLFBGA
Block OrganizationSymmetrical
Chip Density (bit)8G
Command CompatibleYes
Program Current (mA)40(Typ)
Support of Page ModeNo
Standard Package NameBGA
Operating Current (mA)20(Typ)
Number of Bits/Word (bit)1/4/8
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3.3
Description
Managed NAND Flash Serial e-MMC 3.3V 8G-bit 8G/2G/1G x 1/4-bit/8-bit 169-Pin LFBGA
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