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Flash QH25F640S33B8A
Micron Technology
QH25F640S33B8A
--
Memory
Flash
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeNOR
ECCN (US)3A991.b.1.a
PackagingTray
Pin Count16
AutomotiveNo
Boot BlockYes
Lead ShapeGull-wing
ECC SupportNo
PCB changed16
Part StatusUnconfirmed
Sector Size8Kbyte x 8|64Kbyte x 127
Timing TypeSynchronous
ArchitectureSectored
Package Width7.52
Interface TypeSerial-SPI
Package Height2.36
Package Length10.34
Number of Words4M
ProgrammabilityYes
Supplier PackageSOIC
Block OrganizationAsymmetrical
Chip Density (bit)64M
Command CompatibleNo
Program Current (mA)25
Support of Page ModeNo
Standard Package NameSOP
Location of Boot BlockBottom
Maximum Erase Time (s)512/Chip
Operating Current (mA)10
Address Bus Width (bit)1
Number of Bits/Word (bit)16
Supplier Temperature GradeExtended
Maximum Programming Time (ms)10/Page
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Description
NOR Flash Serial-SPI 3V/3.3V 64M-bit 4M x 16 16-Pin SOIC Tray
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