Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Bank Size | 8/8/8/8/8/8/8/8/8/8/8/8/8/8/8/8Mb |
Cell Type | NOR |
ECCN (US) | 3A991.b.1.a |
Packaging | Tray |
Pin Count | 84 |
Automotive | No |
Boot Block | Yes |
Lead Shape | Ball |
ECC Support | No |
PCB changed | 84 |
Part Status | Obsolete |
Sector Size | 128Kbyte x 126|32Kbyte x 8 |
Timing Type | Synchronous|Asynchronous |
Architecture | Sectored |
Package Width | 8 |
Interface Type | Parallel|Serial |
Package Height | 0.76(Max) |
Package Length | 11.6 |
Number of Banks | 16 |
Number of Words | 8M |
Programmability | Yes |
Supplier Package | FBGA |
Block Organization | Asymmetrical |
Chip Density (bit) | 128M |
Command Compatible | Yes |
Process Technology | 110nm, MirrorBit |
OE Access Time (ns) | 11.2 |
Program Current (mA) | 52.5 |
Support of Page Mode | No |
Max. Access Time (ns) | 70 |
Standard Package Name | BGA |
Location of Boot Block | Top|Bottom |
Maximum Erase Time (s) | 154/Chip |
Operating Current (mA) | 66 |
Address Bus Width (bit) | 23 |
Programming Voltage (V) | 8.5 to 9.5|1.7 to 1.95 |
Number of Bits/Word (bit) | 16 |
Minimum Endurance (Cycles) | 100000(Typ) |
Supplier Temperature Grade | Wireless |
Maximum Programming Time (ms) | 157300/Chip |
Maximum Operating Frequency (MHz) | 80 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Supply Voltage (V) | 1.95 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |