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SST39VF1682-70-4C-B3KE
SST39VF1682-70-4C-B3KE
Flash SST39VF1682-70-4C-B3KE
Microchip Technology
SST39VF1682-70-4C-B3KE
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeNAND
ECCN (US)3A991.b.1.a
PackagingTray
Pin Count48
AutomotiveNo
Boot BlockYes
Lead ShapeBall
ECC SupportNo
PCB changed48
Part StatusActive
Sector Size4Kbyte x 512
Timing TypeAsynchronous
ArchitectureSectored
Package Width6
Interface TypeParallel
Package Height0.75
Package Length8
Number of Words2M
ProgrammabilityYes
Supplier PackageTFBGA
Block OrganizationSymmetrical
Chip Density (bit)16M
Command CompatibleYes
OE Access Time (ns)35
Program Current (mA)35
Support of Page ModeNo
Max. Access Time (ns)70
Standard Package NameBGA
Location of Boot BlockTop
Maximum Erase Time (S)0.05/Chip
Operating Current (mA)18
Address Bus Width (bit)21
Programming Voltage (V)2.7 to 3.6
Number of Bits/Word (bit)8
Minimum Endurance (Cycles)10000
Supplier Temperature GradeCommercial
Maximum Programming Time (ms)0.01/Byte
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3.3
Description
NAND Flash Parallel 3.3V 16M-bit 2M x 8 70ns 48-Pin TFBGA Tray
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