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SF-1206HI150M-2
SF-1206HI150M-2
Fuses SF-1206HI150M-2
Bourns
SF-1206HI150M-2
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Circuit Protection
Fuses
Specification
Product AttributeAttribute Value
HTS8536.10.00.40
PPAPNo
TypeChip
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
AutomotiveNo
ApplicationDisk Drive|Industrial Controller|Battery Charger|Cell Phone|DVD|Digital Camera
Part StatusActive
Package/Case1206
Fuse MaterialCeramic
Fuse Size (mm)3.2 X 1.6 X 0.97
Termination StyleSolder Pad
Current Rating (A)1.5
Product Depth (mm)1.6
Voltage Rating (V)63
Number of Terminals2
Product Height (mm)0.97
Product Length (mm)3.2
Typical Melting I2t (A²S)0.333
Maximum DC Voltage Rating (V)63
Typical Cold Resistance (Ohm)0.1493
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Description
Fuse Chip 1.5A 63V SMD Solder Pad 1206 Ceramic T/R
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