Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | Yes |
Type | IGBT|MOSFET |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 14 |
Automotive | Yes |
Lead Shape | Gull-wing |
Bridge Type | Half Bridge |
Driver Type | High and Low Side |
PCB changed | 14 |
Part Status | Active |
Package Width | 4(Max) |
Latch-Up Proof | No |
Package Height | 1.5(Max) |
Package Length | 8.75(Max) |
Special Features | Under Voltage Lockout |
Supplier Package | SOIC N |
Number of Drivers | 2 |
Number of Outputs | 2 |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 50 |
Maximum Rise Time (ns) | 50 |
Maximum Supply Current (mA) | 0.8 |
High and Low Sides Dependency | Synchronous |
Maximum Power Dissipation (mW) | 800 |
Maximum Turn-On Delay Time (ns) | 55 |
Maximum Turn-Off Delay Time (ns) | 55 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Time (ns) | 200 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 22 |
Minimum Operating Supply Voltage (V) | 10 |
Typical Input Low Threshold Voltage (V) | 1.2(Max) |
Typical Input High Threshold Voltage (V) | 2.5(Min) |
Description |