Product Attribute | Attribute Value |
HTS | 8542330001 |
PPAP | No |
Type | IGBT|MOSFET |
EU RoHS | Not Compliant |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 28 |
Automotive | No |
Lead Shape | Through Hole |
Bridge Type | 3-Phase Bridge |
Driver Type | High and Low Side |
PCB changed | 28 |
Part Status | Obsolete |
Package Width | 14.73(Max) |
Package Height | 6.35(Max) - 0.39(Min) |
Package Length | 39.75(Max) |
Special Features | Current Sensing|Undervoltage Lockout |
Supplier Package | PDIP |
Number of Drivers | 6 |
Number of Outputs | 6 |
Process Technology | HVIC |
Standard Package Name | DIP |
Maximum Fall Time (ns) | 55 |
Maximum Rise Time (ns) | 125 |
Input Logic Compatibility | CMOS|LSTTL|2.5V(Min) |
High and Low Sides Dependency | Independent |
Maximum Power Dissipation (mW) | 1500 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Time (ns) | 850 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 20 |
Minimum Operating Supply Voltage (V) | 10 |
Typical Input Low Threshold Voltage (V) | 0.8(Max) |
Typical Input High Threshold Voltage (V) | 2.2(Min) |
Description |