Product Attribute | Attribute Value |
HTS | 8542.31.00.01 |
PPAP | No |
Type | IGBT|MOSFET |
EU RoHS | Compliant |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 14 |
Automotive | No |
Lead Shape | Through Hole |
Bridge Type | Half Bridge |
Driver Type | High and Low Side |
PCB changed | 14 |
Part Status | NRND |
Package Width | 7.11(Max) |
Package Height | 4.4(Max) |
Package Length | 20.19(Max) |
Special Features | Undervoltage Lockout|Matched Propagation Delay |
Supplier Package | PDIP |
Number of Drivers | 2 |
Number of Outputs | 2 |
Process Technology | CMOS |
Driver Configuration | Inverting|Non-Inverting |
Reference Voltage (V) | 600(Max) |
Standard Package Name | DIP |
Maximum Fall Time (ns) | 35 |
Maximum Rise Time (ns) | 60 |
Input Logic Compatibility | LSTTL|CMOS|3.3V(Min)|5V |
Maximum Supply Current (mA) | 1.6 |
High and Low Sides Dependency | Synchronous |
Maximum Power Dissipation (mW) | 1600 |
Maximum Turn-On Delay Time (ns) | 90 |
Maximum Turn-Off Delay Time (ns) | 40 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Time (ns) | 900 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 20 |
Minimum Operating Supply Voltage (V) | 10 |
Typical Input Low Threshold Voltage (V) | 8.2 |
Typical Input High Threshold Voltage (V) | 8.9 |
Description |