Product Attribute | Attribute Value |
HTS | 8542.31.00.01 |
PPAP | No |
Type | IGBT|MOSFET |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
Bridge Type | Half Bridge |
Driver Type | High and Low Side |
PCB changed | 8 |
Part Status | Obsolete |
Package Width | 4(Max) |
Latch-Up Proof | No |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC N |
Number of Drivers | 2 |
Number of Outputs | 2 |
Driver Configuration | Inverting |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 170 |
Maximum Rise Time (ns) | 300 |
Input Logic Compatibility | LSTTL|CMOS |
High and Low Sides Dependency | Synchronous |
Maximum Power Dissipation (mW) | 625 |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 20 |
Minimum Operating Supply Voltage (V) | 10 |
Description |