Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | IGBT|MOSFET |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 8 |
Automotive | No |
Bridge Type | Half Bridge |
Driver Type | Low Side |
PCB changed | 8 |
Part Status | Active |
Package Width | 3.9 |
Latch-Up Proof | Yes |
Package Height | 1.25(Min) |
Package Length | 4.9 |
Supplier Package | SOIC N |
Number of Drivers | 2 |
Number of Outputs | 2 |
Driver Configuration | Non-Inverting |
Standard Package Name | SO |
Maximum Fall Time (ns) | 17 |
Maximum Rise Time (ns) | 17 |
Output Resistance (Ohm) | 1.6|2.4 |
Peak Output Current (A) | 3(Typ) |
Supplier Temperature Grade | Extended |
Maximum Supply Current (mA) | 0.9 |
Maximum Power Dissipation (mW) | 1000 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Time (ns) | 26 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 18 |
Minimum Operating Supply Voltage (V) | 4.5 |
Typical Input Low Threshold Voltage (V) | 1.3 |
Typical Input High Threshold Voltage (V) | 1.6 |
Description |