Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | MOSFET |
EU RoHS | Not Compliant |
Mounting | Through Hole |
ECCN (US) | 3A001.a.2.c |
Pin Count | 8 |
Automotive | No |
Lead Shape | Through Hole |
Driver Type | Low Side |
PCB changed | 8 |
Part Status | Obsolete |
Package Width | 6.73 |
Package Height | 3.8 |
Package Length | 9.78 |
Supplier Package | CDIP |
Number of Drivers | 1 |
Number of Outputs | 1 |
Process Technology | MOSFET |
Driver Configuration | Inverting |
Standard Package Name | DIP |
Maximum Fall Time (ns) | 35 |
Maximum Rise Time (ns) | 35 |
Output Resistance (Ohm) | 1.8 |
Peak Output Current (A) | 6(Typ) |
Input Logic Compatibility | CMOS|TTL |
Maximum Supply Current (mA) | 5 |
Maximum Power Dissipation (mW) | 800 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Time (ns) | 75 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Supply Voltage (V) | 18 |
Minimum Operating Supply Voltage (V) | 7 |
Typical Input Low Threshold Voltage (V) | 1.3 |
Typical Input High Threshold Voltage (V) | 1.8 |
Description |