Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | IGBT|MOSFET |
EU RoHS | Compliant |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 8 |
Automotive | No |
Lead Shape | Through Hole |
Driver Type | Low Side |
PCB changed | 8 |
Part Status | Active |
Package Width | 6.6(Max) |
Package Height | 5.08(Max) - 0.51(Min) |
Package Length | 10.16(Max) |
Supplier Package | PDIP |
Number of Drivers | 2 |
Number of Outputs | 2 |
Process Technology | BiCMOS |
Driver Configuration | Inverting |
Standard Package Name | DIP |
Maximum Fall Time (ns) | 40 |
Maximum Rise Time (ns) | 40 |
Output Resistance (Ohm) | 2.2|30 |
Peak Output Current (A) | 4 |
Input Logic Compatibility | CMOS|TTL |
Maximum Supply Current (mA) | 0.45 |
Maximum Power Dissipation (mW) | 780 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Time (ns) | 35 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 15 |
Minimum Operating Supply Voltage (V) | 4.5 |
Typical Input Low Threshold Voltage (V) | 1(Max) |
Typical Input High Threshold Voltage (V) | 2(Min) |
Description |