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IGBT Chip FGA70N33BTDTU
onsemi
FGA70N33BTDTU
--
Diodes, Transistors and Thyristors
IGBT Chip
Specification
| Product Attribute | Attribute Value |
| Tab | Tab |
| PPAP | No |
| SVHC | Yes |
| EU RoHS | Compliant with Exemption |
| Mounting | Through Hole |
| ECCN (US) | EAR99 |
| Packaging | Rail |
| Pin Count | 3 |
| Automotive | No |
| Lead Shape | Through Hole |
| PCB changed | 3 |
| Part Status | Obsolete |
| Channel Type | N |
| Configuration | Single |
| Package Width | 5(Max) |
| Package Height | 18.9(Max) |
| Package Length | 16.2(Max) |
| Supplier Package | TO-3PN |
| Standard Package Name | TO-3P |
| Maximum Power Dissipation (mW) | 149000 |
| Maximum Gate Emitter Voltage (V) | ±30 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Collector-Emitter Voltage (V) | 330 |
| Maximum Gate Emitter Leakage Current (uA) | 0.4 |
| Typical Collector Emitter Saturation Voltage (V) | 1.7 |
| Description |
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