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IGBT Chip STGB50H65FB2
STMicroelectronics
STGB50H65FB2
--
Diodes, Transistors and Thyristors
IGBT Chip
Specification
| Product Attribute | Attribute Value |
| Tab | Tab |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 3 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Technology | Trench|Field Stop |
| PCB changed | 2 |
| Part Status | Active |
| Channel Type | N |
| Configuration | Single |
| Package Width | 9.35(Max) |
| Package Height | 4.6(Max) |
| Package Length | 10.4(Max) |
| Supplier Package | D2PAK |
| Standard Package Name | TO-263 |
| Maximum Power Dissipation (mW) | 272000 |
| Maximum Gate Emitter Voltage (V) | ±20 |
| Maximum Operating Temperature (°C) | 175 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Collector-Emitter Voltage (V) | 650 |
| Maximum Continuous Collector Current (A) | 86 |
| Maximum Gate Emitter Leakage Current (uA) | 0.25 |
| Typical Collector Emitter Saturation Voltage (V) | 1.55 |
| Description |
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