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IGBT and MOSFET Gate Driver Photocouplers FOD3150TSR2V
onsemi
FOD3150TSR2V
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Optoelectronics
IGBT and MOSFET Gate Driver Photocouplers
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Automotive | No |
| Output Type | Push-Pull |
| PCB changed | 8 |
| Part Status | Active |
| Package Width | 6.86(Max) |
| Package Height | 3.94(Max) |
| Package Length | 9.91(Max) |
| Supplier Package | PDIP SMD |
| Standard Package Name | DIP |
| Maximum Fall Time (ns) | 60(Typ) |
| Maximum Rise Time (ns) | 60(Typ) |
| Common Mode Voltage (V) | 2000 |
| Maximum Forward Voltage (V) | 1.8 |
| Maximum Reverse Voltage (V) | 5 |
| Minimum Forward Voltage (V) | 1.2 |
| Number of Channels per Chip | 1 |
| Maximum Forward Current (mA) | 16 |
| Minimum Forward Current (mA) | 7 |
| Maximum Power Dissipation (mW) | 250 |
| Maximum Peak Output Current (A) | 1.5 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Maximum Operating Temperature (°C) | 100 |
| Maximum Pulse Width Distortion (ns) | 300 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 30 |
| Minimum Common Mode Rejection (kV/us) | 20 |
| Maximum Working Insulation Voltage (Vp) | 890 |
| Maximum Propagation Delay Time (tPHL) (ns) | 500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 500 |
| Description |
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