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Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| Type | D-Type |
| EU RoHS | Compliant |
| Bus Hold | No |
| Mounting | Surface Mount |
| Polarity | Non-Inverting |
| ECCN (US) | EAR99 |
| Packaging | Tray |
| Pin Count | 54 |
| Set/Reset | No |
| Automotive | No |
| Latch Mode | Transparent |
| Lead Shape | Ball |
| Output Type | 3-State |
| PCB changed | 54 |
| Part Status | Obsolete |
| Logic Family | LCX |
| Package Width | 5.5 |
| Package Height | 0.95(Max) |
| Package Length | 8 |
| Supplier Package | FBGA |
| Tolerant I/Os (V) | 5 |
| Process Technology | CMOS |
| Standard Package Name | BGA |
| Number of Inputs per Chip | 16 |
| Number of Outputs per Chip | 16 |
| Number of Channels per Chip | 16 |
| Number of Elements per Chip | 2 |
| Maximum Quiescent Current (uA) | 20 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Number of Input Enables per Element | 1 |
| Absolute Propagation Delay Time (ns) | 7.9 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 2 |
| Number of Output Enables per Element | 1 |
| Typical Operating Supply Voltage (V) | 2.5|3.3 |
| Maximum Low Level Output Current (mA) | 24 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum High Level Output Current (mA) | -24 |
| Number of Selection Inputs per Element | 0 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 5.9@2.7V|5.4@3.3V |
| Description |
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Beam Electronics is a one-stop platform for electronic components from overseas sites under the "BEAM TECHNOLOGY COMPANY LIMITED" (supporting online ordering and trading). Beam Electronics is committed to building an efficient overseas intelligent IC components trading platform, the main business scope of overseas regions! With the wisdom of data-driven services, the company aims to improve procurement efficiency for the midstream and downstream enterprises in the IC industry, and is determined to become a reliable one-stop procurement platform for overseas IC supply chain.
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