Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | D-Type |
EU RoHS | Compliant |
Bus Hold | Yes |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 20 |
Set/Reset | No |
Automotive | No |
Latch Mode | Transparent |
Lead Shape | Ball |
Output Type | 3-State |
PCB changed | 20 |
Part Status | Obsolete |
Logic Family | ALVC |
Package Width | 3.1(Max) |
Package Height | 0.65(Max) |
Package Length | 4.1(Max) |
Supplier Package | BGA MICROSTAR JUNIOR |
Process Technology | CMOS |
Standard Package Name | BGA |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Supplier Temperature Grade | Commercial |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 20 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Number of Input Enables per Element | 1 |
Absolute Propagation Delay Time (ns) | 6.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 1.65 |
Number of Output Enables per Element | 1 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
Maximum Low Level Output Current (mA) | 24 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -24 |
Number of Selection Inputs per Element | 0 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 4@2.7V|3.6@3.3V |
Description |