Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | D-Type |
EU RoHS | Compliant |
Bus Hold | No |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Set/Reset | No |
Automotive | No |
Latch Mode | Transparent |
Lead Shape | Ball |
Output Type | 3-State |
PCB changed | 6 |
Part Status | Active |
Logic Family | LVC |
Package Width | 0.92(Max) |
Package Height | 0.31(Max) |
Package Length | 1.42(Max) |
Supplier Package | DSBGA |
Tolerant I/Os (V) | 5.5 Inputs |
Process Technology | CMOS |
Standard Package Name | BGA |
Number of Inputs per Chip | 1 |
Number of Outputs per Chip | 1 |
Supplier Temperature Grade | Commercial |
Number of Channels per Chip | 1 |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 10 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Number of Input Enables per Element | 1 |
Absolute Propagation Delay Time (ns) | 17.4 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 1.65 |
Number of Output Enables per Element | 1 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
Maximum Low Level Output Current (mA) | 32 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -32 |
Number of Selection Inputs per Element | 0 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 5.4@3.3V|4@5V |
Description |