Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Supplier Unconfirmed |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 16 |
Automotive | No |
Lead Shape | Through Hole |
PCB changed | 16 |
Part Status | Obsolete |
Logic Family | HEF4000 |
Package Width | 7.1(Max) |
Logic Function | Binary Full Adder |
Number of Bits | 4 |
Package Height | 5.1(Max) - 0.51(Min) |
Package Length | 20(Max) |
Supplier Package | PDIP |
Process Technology | CMOS |
Standard Package Name | DIP |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 200 |
Maximum Quiescent Current (mA) | 0.1 |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -55 |
Absolute Propagation Delay Time (ns) | 800 |
Maximum Operating Supply Voltage (V) | 20 |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3|5|9|12|15|18 |
Maximum Low Level Output Current (mA) | 2.4(Min) |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -2.4(Min) |
Maximum Propagation Delay Time @ Maximum CL (ns) | 800@5V|320@10V|230@15V |
Description |