Product Attribute | Attribute Value |
HTS | 8541.21.00.95 |
PPAP | Yes |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | Yes |
Lead Shape | Gull-wing |
PCB changed | 3 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 1.3 |
Package Height | 0.94 |
Package Length | 2.9 |
Product Category | Small Signal |
Supplier Package | SOT-23 |
Maximum IDSS (uA) | 1 |
Standard Package Name | SOT |
Supplier Temperature Grade | Automotive |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 300 |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 25(Max) |
Typical Turn-On Delay Time (ns) | 20(Max) |
Maximum Drain Source Voltage (V) | 60 |
Typical Turn-Off Delay Time (ns) | 40(Max) |
Maximum Diode Forward Voltage (V) | 1.5 |
Maximum Gate Threshold Voltage (V) | 2.5 |
Minimum Gate Threshold Voltage (V) | 1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 0.115 |
Operating Junction Temperature (°C) | -55 to 150 |
Maximum Drain Source Resistance (mOhm) | 7500@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 0.8 |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 0.225 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 5(Max)@25V |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 556 |
Description |