Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 4 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 4 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Dual Drain |
Package Width | 1 |
Package Height | 0.28(Max) |
Package Length | 1 |
Product Category | Power MOSFET |
Supplier Package | DSBGA |
Maximum IDSS (uA) | 1 |
Process Technology | NexFET |
Standard Package Name | BGA |
Typical Fall Time (ns) | 7 |
Typical Rise Time (ns) | 7 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 1800 |
Typical Gate Charge @ Vgs (nC) | 6@4.5V |
Maximum Gate Source Voltage (V) | ±10 |
Typical Turn-On Delay Time (ns) | 6 |
Maximum Drain Source Voltage (V) | 12 |
Typical Turn-Off Delay Time (ns) | 17 |
Typical Gate to Drain Charge (nC) | 2.1 |
Maximum Gate Threshold Voltage (V) | 1.3 |
Typical Gate Threshold Voltage (V) | 1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 1.6 |
Typical Input Capacitance @ Vds (pF) | 663@6V |
Maximum Drain Source Resistance (mOhm) | 17.1@4.5V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |