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MOSFETs CSD25213W10
Texas Instruments
CSD25213W10
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| SVHC | Yes |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 4 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 4 |
| Part Status | Active |
| Channel Mode | Enhancement |
| Channel Type | P |
| Configuration | Single Dual Source |
| Package Width | 1 |
| Package Height | 0.28(Max) |
| Package Length | 1 |
| Product Category | Power MOSFET |
| Supplier Package | DSBGA |
| Maximum IDSS (uA) | 1 |
| Process Technology | NexFET |
| Standard Package Name | BGA |
| Typical Fall Time (ns) | 970 |
| Typical Rise Time (ns) | 520 |
| Number of Elements per Chip | 1 |
| Maximum Power Dissipation (mW) | 1000 |
| Typical Gate Charge @ Vgs (nC) | 2.2@4.5V |
| Maximum Gate Source Voltage (V) | -6 |
| Typical Turn-On Delay Time (ns) | 510 |
| Maximum Drain Source Voltage (V) | 20 |
| Typical Turn-Off Delay Time (ns) | 1000 |
| Typical Gate to Drain Charge (nC) | 0.14 |
| Maximum Gate Threshold Voltage (V) | 1.1 |
| Typical Gate Threshold Voltage (V) | 0.85 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 1.6 |
| Typical Input Capacitance @ Vds (pF) | 368@10V |
| Maximum Drain Source Resistance (MOhm) | 47@4.5V |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Description |
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