HTS | 8541.29.00.95 |
Tab | Tab |
PPAP | No |
SVHC | Yes |
EU RoHS | Compliant with Exemption |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 2 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 6.22(Max) |
Package Height | 2.39(Max) |
Package Length | 6.73(Max) |
Product Category | Power MOSFET |
Supplier Package | DPAK |
Maximum IDSS (uA) | 1 |
Process Technology | PowerTrench |
Standard Package Name | TO-252 |
SVHC Exceeds Threshold | Yes |
Typical Fall Time (ns) | 5 |
Typical Rise Time (ns) | 10 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 63000 |
Typical Gate Charge @ 10V (nC) | 14.3 |
Typical Gate Charge @ Vgs (nC) | 14.3@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Output Capacitance (pF) | 96 |
Typical Turn-On Delay Time (ns) | 14 |
Maximum Drain Source Voltage (V) | 150 |
Typical Gate Plateau Voltage (V) | 5.3 |
Typical Turn-Off Delay Time (ns) | 20 |
Maximum Diode Forward Voltage (V) | 1.25 |
Typical Gate to Drain Charge (nC) | 3.5 |
Maximum Gate Threshold Voltage (V) | 4 |
Minimum Gate Threshold Voltage (V) | 2 |
Typical Gate to Source Charge (nC) | 5 |
Typical Reverse Recovery Time (ns) | 63 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 26 |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 965@75V |
Typical Reverse Recovery Charge (nC) | 131 |
Maximum Drain Source Resistance (MOhm) | 40@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 20 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 104 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 5.8@75V |
Description | |