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FDS6898A
FDS6898A
MOSFETs FDS6898A
onsemi
FDS6898A
--
Diodes, Transistors and Thyristors
MOSFETs
FDS6898A.pdf
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count8
AutomotiveNo
Lead ShapeGull-wing
PCB changed8
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationDual Dual Drain
Package Width3.9
Package Height1.5(Max)
Package Length4.9
Product CategoryPower MOSFET
Supplier PackageSOIC
Maximum IDSS (uA)1
Process TechnologyPowerTrench
Standard Package NameSOP
Typical Fall Time (ns)16
Typical Rise Time (ns)15
Number of Elements per Chip2
Maximum Power Dissipation (mW)2000
Typical Gate Charge @ 10V (nC)16
Typical Gate Charge @ Vgs (nC)16@4.5V
Maximum Gate Source Voltage (V)±12
Typical Output Capacitance (pF)440
Typical Turn-On Delay Time (ns)10
Maximum Drain Source Voltage (V)20
Typical Gate Plateau Voltage (V)1.9
Typical Turn-Off Delay Time (ns)34
Maximum Diode Forward Voltage (V)1.2
Typical Diode Forward Voltage (V)0.7
Typical Gate to Drain Charge (nC)4
Maximum Gate Threshold Voltage (V)1.5
Minimum Gate Threshold Voltage (V)0.5
Typical Gate Threshold Voltage (V)1
Typical Gate to Source Charge (nC)3
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)9.4
Operating Junction Temperature (°C)-55 to 150
Typical Input Capacitance @ Vds (pF)1821@10V
Maximum Drain Source Resistance (mOhm)14@4.5V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)12
Maximum Pulsed Drain Current @ TC=25°C (A)38
Maximum Power Dissipation on PCB @ TC=25°C (W)1.6
Typical Reverse Transfer Capacitance @ Vds (pF)208@10V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)9.4
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)135
Description
Trans MOSFET N-CH 20V 9.4A 8-Pin SOIC T/R
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