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Specification
| Product Attribute | Attribute Value |
| HTS | 8541.21.00.95 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 8 |
| Part Status | Obsolete |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Dual Dual Drain |
| Package Width | 3.9 |
| Package Height | 1.5(Max) |
| Package Length | 4.9 |
| Product Category | Power MOSFET |
| Supplier Package | SOIC N |
| Maximum IDSS (uA) | 1 |
| Process Technology | PowerTrench |
| Standard Package Name | SOP |
| Typical Fall Time (ns) | 7@Q 1|18@Q 2 |
| Typical Rise Time (ns) | 14@Q 1|11@Q 2 |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 2000 |
| Typical Gate Charge @ Vgs (nC) | 8.5@5V@Q 1|18.5@5V@Q 2 |
| Maximum Gate Source Voltage (V) | ±20 |
| Typical Output Capacitance (pF) | 160@Q 1|420@Q 2 |
| Typical Turn-On Delay Time (ns) | 10@Q 1|15@Q 2 |
| Maximum Drain Source Voltage (V) | 30 |
| Typical Gate Plateau Voltage (V) | 2.8@Q 1|3.3@Q 2 |
| Typical Turn-Off Delay Time (ns) | 21@Q 1|36@Q 2 |
| Maximum Diode Forward Voltage (V) | 1.2 |
| Typical Diode Forward Voltage (V) | 0.74@Q 1|0.72@Q 2 |
| Typical Gate to Drain Charge (nC) | 3.1@Q 1|6.2@Q 2 |
| Maximum Gate Threshold Voltage (V) | 3 |
| Minimum Gate Threshold Voltage (V) | 1 |
| Typical Gate Threshold Voltage (V) | 1.6@Q 1|2.2@Q 2 |
| Typical Gate to Source Charge (nC) | 2.4@Q 1|7.3@Q 2 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 6.3@Q 1|8.6@Q 2 |
| Operating Junction Temperature (°C) | -55 to 150 |
| Typical Input Capacitance @ Vds (pF) | 760@10V@Q 1|2085@10V@Q 2 |
| Maximum Drain Source Resistance (MOhm) | 28@10V@Q 1|15@10V@Q 2 |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Maximum Positive Gate Source Voltage (V) | 20 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 20@Q 1|30@Q 2 |
| Maximum Power Dissipation on PCB @ TC=25°C (W) | 1.6 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 70@10V@Q 1|160@10V@Q 2 |
| Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 6.3@Q 1|8.6@Q 2 |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 135 |
| Description |
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