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IPB009N03LGATMA1
IPB009N03LGATMA1
MOSFETs IPB009N03LGATMA1
Infineon
IPB009N03LGATMA1
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Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
TabTab
PPAPNo
SVHCYes
EU RoHSCompliant with Exemption
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count7
AutomotiveNo
Lead ShapeGull-wing
PCB changed6
Part StatusLTB
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Quint Source
Package Width9.25
Package Height4.4
Package Length10
Product CategoryPower MOSFET
Supplier PackageD2PAK
Maximum IDSS (uA)2
Process TechnologyOptiMOS
Standard Package NameTO-263
SVHC Exceeds ThresholdYes
Typical Fall Time (ns)22
Typical Rise Time (ns)14
Typical Switch Charge (nC)46
Number of Elements per Chip1
Maximum Power Dissipation (mW)250000
Typical Gate Charge @ 10V (nC)227
Typical Gate Charge @ Vgs (nC)110@4.5V|227@10V
Maximum Gate Source Voltage (V)±20
Typical Output Capacitance (pF)5700
Typical Turn-On Delay Time (ns)26
Maximum Drain Source Voltage (V)30
Typical Gate Plateau Voltage (V)2.9
Typical Turn-Off Delay Time (ns)103
Maximum Diode Forward Voltage (V)1
Typical Diode Forward Voltage (V)0.82
Typical Gate to Drain Charge (nC)24
Maximum Gate Threshold Voltage (V)2.2
Minimum Gate Threshold Voltage (V)1
Typical Gate to Source Charge (nC)50
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)180
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)19000@15V
Typical Reverse Recovery Charge (nC)135
Maximum Drain Source Resistance (mOhm)0.95@10V
Maximum Gate Source Leakage Current (nA)100
Maximum Positive Gate Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)1260
Typical Reverse Transfer Capacitance @ Vds (pF)360@15V
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)62
Description
Trans MOSFET N-CH 30V 180A 7-Pin(6+Tab) D2PAK T/R
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