Product Attribute | Attribute Value |
Tab | Tab |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Through Hole |
ECCN (US) | EAR99 |
Pin Count | 3 |
Automotive | No |
Lead Shape | Through Hole |
PCB changed | 2 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 25.53(Max) |
Package Height | 7.74(Max) |
Package Length | 39.37(Max) |
Product Category | Power MOSFET |
Supplier Package | TO-3 |
Process Technology | HEXFET |
Typical Fall Time (ns) | 98(Max) |
Typical Rise Time (ns) | 120(Max) |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 300000 |
Typical Gate Charge @ 10V (nC) | 190(Max) |
Typical Gate Charge @ Vgs (nC) | 190(Max)@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 35(Max) |
Maximum Drain Source Voltage (V) | 500 |
Typical Turn-Off Delay Time (ns) | 130(Max) |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 21 |
Typical Input Capacitance @ Vds (pF) | 4300@25V |
Maximum Drain Source Resistance (mOhm) | 310@10V |
Description |