Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
PCB changed | 6 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Single Quad Drain |
Package Width | 1.75(Max) |
Package Height | 1.3(Max) |
Package Length | 3(Max) |
Product Category | Power MOSFET |
Supplier Package | TSOP |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 126 |
Typical Rise Time (ns) | 27 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 2000 |
Typical Gate Charge @ Vgs (nC) | 8.3@4.5V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 6.2 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 94 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 4 |
Typical Input Capacitance @ Vds (pF) | 594@25V |
Maximum Drain Source Resistance (MOhm) | 86@4.5V |
Description |