Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual Dual Drain |
Package Width | 3.95(Max) |
Package Height | 0.37(Max) |
Package Length | 3.95(Max) |
Product Category | Power MOSFET |
Supplier Package | Direct-FET SA |
Maximum IDSS (uA) | 1 |
Process Technology | HEXFET |
Typical Fall Time (ns) | 23 |
Typical Rise Time (ns) | 50 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1700 |
Typical Gate Charge @ Vgs (nC) | 8.8@4.5V |
Maximum Gate Source Voltage (V) | ±16 |
Typical Turn-On Delay Time (ns) | 9.7 |
Maximum Drain Source Voltage (V) | 25 |
Typical Turn-Off Delay Time (ns) | 13 |
Maximum Gate Threshold Voltage (V) | 2.1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -40 |
Maximum Continuous Drain Current (A) | 16 |
Typical Input Capacitance @ Vds (pF) | 1350@13V |
Maximum Drain Source Resistance (mOhm) | 4.2@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |