Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N|P |
Configuration | Dual Dual Drain |
Package Width | 4(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | SOIC |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 7.7@N Channel|18@P Channel |
Typical Rise Time (ns) | 21@N Channel|17@P Channel |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1400 |
Typical Gate Charge @ Vgs (nC) | 25(Max)@4.5V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 6.8@N Channel|11@P Channel |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 22@N Channel|25@P Channel |
Maximum Gate Threshold Voltage (V) | 1 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 4@N Channel|3@P Channel |
Typical Input Capacitance @ Vds (pF) | 520@15V@N Channel|440@15V@P Channel |
Maximum Drain Source Resistance (MOhm) | 50@10V@N Channel|100@10V@P Channel |
Description |