Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P|N |
Configuration | Dual Dual Drain |
Package Width | 4(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Product Category | Power MOSFET |
Supplier Package | SOIC |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 34@N Channel|25@P Channel |
Typical Rise Time (ns) | 7.6@N Channel|13@P Channel |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 2000 |
Typical Gate Charge @ Vgs (nC) | 8.6(Max)@4.5V@N Channel|6.6(Max)@4.5V@P Channel |
Maximum Gate Source Voltage (V) | ±12@N Channel|±8@P Channel |
Typical Turn-On Delay Time (ns) | 6@N Channel|9.6@P Channel |
Maximum Drain Source Voltage (V) | 12 |
Typical Turn-Off Delay Time (ns) | 27@P Channel|26@N Channel |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 3@P Channel|6.3@N Channel |
Typical Input Capacitance @ Vds (pF) | 640@9V@N Channel|490@9V@P Channel |
Maximum Drain Source Resistance (mOhm) | 150@4.5V@P Channel|34@4.5V@N Channel |
Description |