Product Attribute | Attribute Value |
PPAP | No |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Dual Dual Source |
Package Width | 4.4 |
Package Height | 1 |
Package Length | 3 |
Product Category | Power MOSFET |
Supplier Package | TSSOP |
Process Technology | HEXFET |
Standard Package Name | SOP |
Typical Fall Time (ns) | 170 |
Typical Rise Time (ns) | 18 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1000 |
Typical Gate Charge @ Vgs (nC) | 12@4.5V |
Maximum Gate Source Voltage (V) | ±8 |
Typical Turn-On Delay Time (ns) | 12 |
Maximum Drain Source Voltage (V) | 12 |
Typical Turn-Off Delay Time (ns) | 160 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 4.3 |
Typical Input Capacitance @ Vds (pF) | 1400@10V |
Maximum Drain Source Resistance (MOhm) | 40@4.5V |
Description |