HTS | 8541.29.00.95 |
Tab | Tab |
PPAP | No |
EU RoHS | Compliant with Exemption |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 2 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 9.65(Max) |
Package Height | 4.83(Max) |
Package Length | 10.41(Max) |
Product Category | Power MOSFET |
Supplier Package | D2PAK |
Maximum IDSS (uA) | 25 |
Standard Package Name | TO-263 |
Typical Fall Time (ns) | 19 |
Typical Rise Time (ns) | 25 |
Number of Elements per Chip | 1 |
Maximum Gate Resistance (Ohm) | 3.7 |
Minimum Gate Resistance (Ohm) | 0.7 |
Maximum Power Dissipation (mW) | 3100 |
Typical Gate Charge @ 10V (nC) | 39(Max) |
Typical Gate Charge @ Vgs (nC) | 39(Max)@10V |
Maximum Gate Source Voltage (V) | ±30 |
Typical Output Capacitance (pF) | 170 |
Typical Turn-On Delay Time (ns) | 12 |
Maximum Drain Source Voltage (V) | 500 |
Typical Gate Plateau Voltage (V) | 6.2 |
Typical Turn-Off Delay Time (ns) | 27 |
Maximum Diode Forward Voltage (V) | 2 |
Typical Gate to Drain Charge (nC) | 19(Max) |
Maximum Gate Threshold Voltage (V) | 4 |
Minimum Gate Threshold Voltage (V) | 2 |
Typical Gate to Source Charge (nC) | 10(Max) |
Typical Reverse Recovery Time (ns) | 490 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 8 |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 1100@25V |
Typical Reverse Recovery Charge (nC) | 3000 |
Maximum Drain Source Resistance (MOhm) | 850@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Maximum Positive Gate Source Voltage (V) | 30 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 28 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 18@25V |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 40 |
Description | |